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ASE Technology Holding Co., Ltd. (ASX)

NYSE Technology Semiconductors
$41.06 ▲ +2.68%
Market Cap
$90.28B
Sector
Technology
Industry
Semiconductors
Beta
1.46
52-Wk Range
10.93-45.52
CEO
Jason Chang
Country
TW
Currency
USD

ASE Technology Holding Co., Ltd. operates in the Semiconductors industry of the Technology sector, headquartered in Kaohsiung, KH, TW. The stock last traded at $41.06, up 2.68% on the session, giving a market capitalisation of $90.28B. On trailing twelve-month figures it carries a trailing P/E of 45.87, a net margin of 8.5%. Its beta of 1.46 implies it has historically moved more than the broad market.

Valuation & profitability (TTM)
P/E
45.87
Price / Sales
3.94
Price / Book
7.19
EV / EBITDA
19.56
Gross margin
19.5%
Operating margin
9.8%
Net margin
8.5%
Return on equity
Debt / equity
0.76
Current ratio
1.07
Dividend yield
1.0%
Payout ratio
37.9%
Company profile
Exchange
New York Stock Exchange
Employees
96,436
IPO date
2000-10-02
Headquarters
Kaohsiung, KH, TW
About ASE Technology Holding Co., Ltd.

Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.

Comparable companies

ASE Technology Holding Co., Ltd. is most often compared with the following Technology names:

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