Disco Corporation (DISPF)

OTC Technology Semiconductors

Disco Corporation specializes in the global production and distribution of advanced machinery for precision cutting, grinding, and polishing applications. Its product portfolio encompasses a wide array of specialized equipment, such as dicing saws, laser saws, grinders, and polishers. It also offers wafer mounters, die separators, surface planers, and waterjet saws, alongside solutions for pre-grinding dicing and package singulation. Beyond the machines themselves, Disco provides essential precision processing tools like dicing blades, grinding wheels, and dry polishing wheels. Additionally, i…