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Micro-Mechanics (Holdings) Ltd. (MCRNF)

OTC Technology Semiconductors
$2.17 ▲ +0.00%
Market Cap
$301.6M
Sector
Technology
Industry
Semiconductors
Beta
0.29
52-Wk Range
1.27-2.96
CEO
Kyle Christopher Borch
Country
SG
Currency
USD

Micro-Mechanics (Holdings) Ltd. operates in the Semiconductors industry of the Technology sector, headquartered in Singapore, CE, SG. The stock last traded at $2.17, up 0.00% on the session, giving a market capitalisation of $301.6M. On trailing twelve-month figures it carries a trailing P/E of 28.37, a net margin of 19.6%. Its beta of 0.29 implies it has historically moved less than the broad market.

Valuation & profitability (TTM)
P/E
28.37
Price / Sales
5.55
Price / Book
7.47
EV / EBITDA
14.80
Gross margin
50.8%
Operating margin
29.3%
Net margin
19.6%
Return on equity
Debt / equity
0.06
Current ratio
4.70
Dividend yield
2.1%
Payout ratio
60.4%
Company profile
Exchange
Other OTC
Employees
450
IPO date
2013-04-25
Headquarters
Singapore, CE, SG
About Micro-Mechanics (Holdings) Ltd.

Micro-Mechanics (Holdings) Ltd. specializes in engineering, producing, and distributing high-precision components and instruments vital for the wafer fabrication and assembly stages within the semiconductor industry. The company's operations span five geographical divisions: Singapore, Malaysia, the Philippines, the USA, and China. Its extensive product range addresses various aspects of semiconductor manufacturing. For instance, in die attach-pick-up processes, it offers items such as rubber tips, high-temperature plastic tools, tungsten carbide die collets, and vacuum wand tools. For die attach-dispensing, products include dispense nozzle adaptors, various dispense nozzles, and epoxy stamping tools, while die attach-die ejection components comprise ejector needles and associated seals. The company further provides a suite of bonding solutions, including clamps and electronic flame off products for thermosonic bonding, and clamps, bearing base assemblies, anvils, and wire cutters for ultrasonic bonding. Encapsulation needs are met with products like BGA dispensing nozzles, dispensing manifolds, pump screws, and O-rings. Additionally, Micro-Mechanics offers contract manufacturing services, crafting custom precision parts and assemblies for original equipment manufacturers (OEMs), and also develops specialized precision components and modules. The company was established in 1983 and is headquartered in Singapore.

Comparable companies

Micro-Mechanics (Holdings) Ltd. is most often compared with the following Technology names:

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